100W 940nm Unmounted Laser Bar

Laser chips are produced under the strictest quality controls. We work only with state-of-the-art epitaxy, processing, and facet coating technology. Standard soldering methods are used for assembling laser chip. The material supports both soft solder (indium) and hard solder (gold/tin). The standard configuration of the laser chip is an emitter structure separated on the p-side. On request, laser chips are available with continuous p-side metallization and adapted facet coatings, using low AR coatings for the assembly of external resonators