Description
2W 808nm COS AuSn bonding Laser Diode
Features:
- Chip on submount design
- High stability, Long lifetime
- High reliability, AuSn bonding
- RoHS compliance
Application:
- Medical
- Printing
- Industry
- Pumping
- BrandNew delivers diode lasers employing professional coupling technology, that enjoy multiple advantages, e.g., compact design, stable output power, high power, high efficiency and convenient packaging.
- These laser diode modules can provide solutions for fiber laser applications and direct suppliers.
- The performance and aging tests have been performed upon the production line to guarantee reliable, stable and long lifetime of products.
- To provide customers with high-quality, high cost performance products is the company's goal.
Specification
Item Number: COS808KZ2
| Optical | |
| Center Wavelength | 808nm±10nm |
| Output Power | 2W |
| Emiter Width | 50um |
| Electrical | |
| Threshold Current Lth | 0.25A |
| Operating Current Lop | 2A |
| Operating Voltage Vop | 1.9V |
| Thermal | |
| Test Temp. | 25℃ |
| Wavelength Temperature Coefficient | 0.35nm/℃ |
Drawing:
For typical P-side-up CoS die bonding, the critical CoS dimension, OH, for HPLD die bonding is the laser chip overhang of A (emitter surface line) to C (AuSn surface line).
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