300mW 500mW 974nm CW COS Single Longitudinal Mode Diode Laser
Feature:
- Optimized epitaxial structure design
- Efficient package heat dissipation technology
- 300mW/500mW central wavelength to choose
- Single Longitudinal mode
Application:
- Fiber Laser Pumping Source
- Military/ Aerospace
- Autonomous driving lidar
- Defense and security
COS Diode Laser Chips on submount, with safe package. And our products are exported to Europe and America Country. And we put high value on our reputation. Best quality is our principle all the time.
Data Sheet
Item No: COS974DL03; COS974DL05
Item Name: 300mW 500mW COS Laser Diode
| Optical | |
| Center Wavelength | 974nm |
| Output Power | 300mW/500mW |
| Working Mode | CW |
| Longitudinal Mode | Single |
| Spectrum Width | 1.6nm |
| Emitter Width | 4um |
| Fast Axis Divergence(FWHM) | 30Deg |
| Slow Axis Divergence (FWHM) | 30Deg |
| Slope Efficiency | 0.8W/A |
| Electrical | |
| Threshold Current | 30mA |
| Operating Current | 700mA |
| Operating Voltage | 1.7V |
| Power Conversion Efficiency | 40% |
| Thermal | |
| Operating Temperature | 15-25℃ |
| Wavelength Temp. Coefficient | 0.3nm/℃ |
Drawing:
Diode laser engraver module packaging is the optical laser beam shaping, heat dissipation and sealing of the laser diode. Since the electro-optical conversion efficiency of a 5 watt blue laser diode is approximately 30%, the laser diode will produce 10 watts of power. As shown in Figure 3 (A), the diode needs to be soldered to a heat sink sub-mount for thermal stability and further encapsulation. The substrate material for the sub-mount must not only have a high thermal conductivity, but also a coefficient of thermal expansion that matches that of the diode. Ceramics such as AlN and SiC are commonly used as sub-mount substrates, coated on both sides with a Ti/Cu/Au layer.
In addition to the CoS package, another package used in the production of Blu-ray LDs is the TO-CAN package. The diode is hermetically sealed in a metal can as shown in Figure 3(B). In this case, the diode is packaged twice, the first package is a CoS package where a single LD emitter is soldered to the 1st heat sink (i.e., sub-mount). The CoS is then soldered to the base of the TO-header. Finally, the diode is encapsulated with a cap with a clear window (thin glass lens.) TO-CAN packaged blue LDs are widely used in lighting and projection applications.
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