3W 940nm VCSEL Bare Die Chip Laser

3W 940nm VCSEL Bare Die Chip

 

Features:

• 940nm VCSEL bare die with total output power up to 3W
• 624 independent emitter in a high-density design
• Unpackaged chip (die form) for direct integration

Applications:

• High-Performance 3D Sensing & Depth Cameras: Used in high-precision depth-sensing modules for face recognition, robotics, and industrial machine vision.
• LiDAR & Long-Range Distance Measurement: Applied in medium‑range LiDAR systems, AGV navigation, and drone obstacle avoidance.
• IR Illumination for Night Vision & Security Monitoring:  Provides high‑uniformity infrared fill light for surveillance cameras, intelligent access control.
• Biomedical Optical Detection & Spectroscopy: Used in near‑infrared tissue analysis, non‑invasive monitoring, and laboratory sensing equipment. 

This 3W 940nm unpackaged VCSEL die integrates 624 emitters to deliver high power, uniform illumination, and design flexibility. Ideal for 3D sensing, LiDAR, infrared night vision, biomedical detection, and custom OEM optical modules, it offers high efficiency, reliability, and adaptability for advanced optoelectronic systems.

Data Sheet

Item No: VC940ME3

Drawing:

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