940nm 6W VCSEL Ummounted QCW Chip

6W 940nm VCSEL Bare Die Chip

 

Features:

• 940nm VCSEL bare die with 1273 emitting elements
• Unpackaged die structure supports direct die bonding
• Low divergence angle, and no hotspots

Applications:

• High-Power 3D Sensing & Depth Imaging: Applied in high-resolution 3D depth cameras, industrial machine vision, and robot positioning systems. High emitter count and 6W power provide strong.
• Long-Range LiDAR & Obstacle Avoidance Systems: Used in medium-to-long range LiDAR modules, AGV navigation, and drone detection. 
• High-Performance IR Night Vision & Surveillance: Delivers high-brightness, large-area infrared fill light for security cameras, vehicle-mounted night vision.
• Biomedical Optical Detection & Spectroscopy: Serves as a high-power near-infrared light source for non-invasive tissue analysis, medical sensing.

This 6W 940nm unpackaged VCSEL die with 1273 emitters combines high power, ultra-uniform illumination, and high integration flexibility. It is widely used in 3D sensing, LiDAR, infrared night vision, biomedical detection, and custom OEM optical modules. With high efficiency, reliability, and stable array performance, it provides a high-performance core chip solution for advanced high-power infrared optical systems.

Data Sheet

Item No: VC940ME6

Drawing:

Far Field Profile:

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