500mW 974nm CW COS Diode Laser

COS packaging, the full name of which is Chip-on-Submount packaging, is a packaging method that directly mounts a semiconductor chip on a substrate with high thermal conductivity. This method is particularly suitable for high-power semiconductor laser chips because they generate a lot of heat. By mounting the chip on a substrate with high thermal conductivity, the COS package can effectively dissipate heat, thereby maintaining the stability and life of the chip during operation. In addition, this packaging form also allows micro-optical elements to be installed close to the laser surface, achieving excellent control of the beam shape and size. Therefore, the COS package not only increases the optical power of the laser module, but also reduces the module size, making the laser module more efficient and compact.

With its low beam divergence, the chip on submount can be easily coupled to a single mode fiber (SMF).

The stringent reliability requirements are achieved through our innovative manufacturing technology.