High Power Diode Laser Chips

High Power Diode Laser Chips

200W 300W QCW 808nm High-power Laser Chip Bare Chips not bonded on Submount
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Description

High Power Diode Laser Chips

Product Description

Compared with traditional lasers, high power diode laser chips have the advantages of small size, high power, high efficiency and long life. This is because high-power laser chips adopt an integrated design, integrating various components of the laser directly on the chip, and adopting advanced heat dissipation technology, which greatly improves the power output and efficiency of the laser

Application:

Semiconductors for high-power diode lasers in direct material processing, for heating or lighting.
Semiconductors as pumping sources for fiber and solid-state lasers.
Use in printing technology.

Esthetics, dermatology and surgery.

3W Diode Laser Chips
 

 

Spec Sheet:

 

Operation:    
Central Wavelength 808nm  
Optical output power 200W 300W
Operation mode QCW  
Power modulation 100%  
Geometrical:    
Numbers of Emitters 60  
Emitter Width 120um  
Emitter Pitch 160um  
Filling Factor 75%  
Bar Width 10000um  
Cavity Length 1500um  
Thickness 125um  
Electro Optical Data:    
Fast Axis Divergency (FWHM) 39deg  
Slow Axis Divergency (FWHM) 12deg  
Spectral Bandwidth (FWHM) 4nm  
Pulse Wavelength 803nm  
Slope Efficiency 1.2W/A  
Conversion Efficiency 55%  
Threshold Current 25A 30A
Operating Current 190A 280A
Operating Voltage 1.9~2.1V  
Temperature Characteristics 0.28nm/℃  
Polarization TE  
LD Operating Temperature 25℃  

 

 

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