Hangzhou Brandnew Technology Co., Ltd. is one of China's leading manufacturers and premier suppliers of advanced 3w 940nm vcsel laser chip. Operating a state-of-the-art factory, we specialize in the entire production spectrum—from high-performance chips, TO/F/C Mounts, COS, and MCC bars, to robust stacks and advanced fiber-coupled solutions.
1W 940nm VCSEL Laser Chip
Mechanical Specifications
Dimensions
front: 51 mil × 45 mil (1280±25um ×1130±25um)
back: 51 mil × 45 mil (1280±25um ×1130±25um)
thickness: 6mil (150±25um)
bonding pad: 92±15um×1070±15um×2
Aperture: 7±2 um
Emission pitch: 44±1 um
Number of Emission: 621
Materials and Structures
substrate:GaAs
p-metallization:Au alloy
n-metallization:Au alloy
epitaxial structure:InGaAs MQWs
Characteristics
| Parameter | Typ. |
| Center Wavelength | 940±10nm |
| Output Power | 3W |
| Forward Voltage | 1.95V |
| Half Wave | 1.1nm |
| Slope Efficiency | 1.02W/A |
| Dominant Wavelength | 44.1% |
| Wavelength Temp. Coefficient | 0.07nm/℃ |
| Reverse Current | 1uA |
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