With the development trend of miniaturization of semiconductor laser products, Brandnew has developed and launched the WC808VS2000 stacked array series of products. Relying on advanced core technologies such as vacuum eutectic bonding, interface materials and fusion engineering, and transient thermal management, product integration can be achieved , high work efficiency and upgraded thermal management capabilities to ensure the long-term reliability and lifespan of the product.
As an important pump source for semiconductor lasers, bar lasers have further intensified their demand for power density as semiconductor lasers increasingly pursue miniaturization. In response to this challenge, Brandnew successfully developed the innovative product WC808VS2000.
This product accurately reduces the pitch of traditional bar products from the original 0.73mm to 0.38mm, significantly reducing the width of the stacked array light-emitting area. The number of bars of the stacked array product can be expanded to 10bar at the same time, further improving the efficiency of the product and reaching a peak power output of more than 2000W. Compared with traditional products with a pitch of 0.73mm, the new product has achieved a significant improvement of approximately 92% in optical power density.
WC808VS2000 model product adopts the combination of precision and practical concepts. Characterized by its compact appearance, simplicity and smoothness, it provides extremely high flexibility in terms of practicality. In addition, its solid and stable structure and the use of high-reliability components ensure long-term stable operation of the product, greatly reducing possible downtime and reducing additional costs due to maintenance. It is extremely valuable in industrial manufacturing or medical procedures.
At the same time, this model of product uses high thermal conductivity materials that match the CTE of the bar, ensuring good heat dissipation while ensuring material consistency. The finite element method is used to simulate and calculate the temperature field of the device. By effectively combining transient and steady-state thermal simulations, product temperature changes can be better controlled.
This model uses traditional hard solder soldering technology. Through process control, it is ensured that the product achieves the best heat dissipation effect within the set distance. This not only ensures the functionality of the product, but also ensures the safety and durability of the product.
The latest small-pitch high-power semiconductor stacked bar laser launched by Brandnew has been endowed with excellent scalability since its design stage. It can be customized according to the specific needs of customers, including the number of bars, output power, center wavelength and other indicators, fully demonstrating the characteristics of flexible configuration. The modular design allows it to adapt to a wide range of application environments, and can meet various customer needs through the combination of different modules.
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