As high-power semiconductor lasers gradually gain more and more applications in display lighting, medical treatment, sensing and other fields, the industry has more and more requirements for packaging. On the basis of 140W (pulse) TO56 packaged devices, a higher power TO9 packaged device has been developed recently, supporting wavelengths such as 638nm/665nm/808nm/940nm/1470nm/1550nm.
In terms of red lasers (continuous), Brandnew has developed continuous power 1W 638nm TO9 and 2W 665nm TO9 devices, which are mainly used in lighting and medical fields. Among them, the 1W 638nm TO model is TO638DL1, the working current is 1.5A, the voltage is 2.5V, and the slope efficiency is 1W/A. The 2W 665nm TO model is TO665DL2, the working current is 2.1A, the working voltage is 2.4V, and the slope efficiency is 1.3W/A.
In terms of continuous power 808nm devices, Brandnew has developed a 3W TO9 device, which can be used in the fields of laser lighting and medical beauty, model TO808DL3, working current 2.6A, working voltage 2.3V, slope efficiency 1.4 W/A.
In terms of continuous power 940nm devices, Brandnew has developed a 3W 940nm TO9, model TO940DL3, which supports applications such as ranging and 3D sensing, with a working current of 3.2A, working voltage of 1.9V, and slope efficiency. 1.2W/A.
In terms of continuous power 1470nm devices, Brandnew has developed a 1.3W 1470nm TO9, model TO1470dl1, which is mainly used in medical beauty, lighting, scientific research and other fields, with a working current of 3A and a working voltage of 1.7V , the slope efficiency is 0.5W/A.
In terms of pulsed power 1550nm devices, Brandnew has also developed 15W and 30W TO9 devices. Mainly used in the field of laser ranging. The models are TO1550DL15 and TO1550DL30 respectively.
Compared with plastic packaging, metallized TO packaging has the advantage of good heat dissipation. Compared with surface mount, metallized TO packages have the advantage of mass manufacturing. In addition, TO also have airtight packaging, the advantages of convenient use, ease of integration, under the larger changes, outdoor temperature and humidity, and so on and so forth, due TO the laser chip by moisture corrosion and temperature/dust on the wavelength, power, and influence the reliability of the metal for the laser chip + glass can be well protected, able TO cope with a variety of using environment. At the same time, Brandnew can also install fast axis collimated S package and matching cooling parts according to the different needs of customers. Compared with the TO56 package device, the TO9 package device has lower thermal resistance and larger heat dissipation interface, which can effectively improve the output power of the laser.
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