850nm VCSEL series products have the characteristics of high efficiency, high reliability and excellent high temperature performance, and can be widely used in three-dimensional sensing, laser radar, pumping, security, medical and other infrared lighting fields.
In recent years, with the industry’s in-depth research on VCSEL and the expansion of application requirements, VCSEL has entered the consumer electronics market as an infrared light source for 3D sensing applications, becoming the realization of face recognition, gesture detection, 3D recognition, iris recognition, ADAS ( Advanced driving system) and essential components for functions such as VR/AR. With the continuous advancement of 5G infrastructure construction, it is foreseeable that VCSEL applications and market enthusiasm will receive more attention in the future.
850 nm VCSEL chip has the following characteristics:
1. Wide range of types: output power from a few milliwatts, hundreds of milliwatts, general 1 W, 2 W, to high power 4-10W (continuous output) or higher (pulse output);
2. Achieve industry-leading electro-optical conversion efficiency in continuous output (CW) mode, PCE~48% (1 W chip), PCE~46% (8W chip);
3. Maintain good performance at high temperatures. Even at the heat sink temperature of 120°C, the electro-optical conversion efficiency of the 850 nm VCSEL chip exceeds 25%;
4. In order to meet the needs of different customers, multiple designs are used to achieve different divergence angles.
The further improvement of VCSEL chip performance requires careful consideration of every design and process link. This is not only reflected in the specific design of key factors such as the quantum well active area, reflective mirror (DBR), and oxide layer, but also in the overall consideration of chips for different applications and the optimization of the back-end process.
Brandnew can achieve the above excellent performance because of the use of this balanced and comprehensively optimized design concept, combined with optimized epitaxy and wafer processing technology. Compared with traditional VCSEL chips, the 808/850 nm VCSEL launched this time has significantly improved gain, reducing chip stress and all other possible losses. At the same time, it also focuses on the physical characteristics of the chip under high temperature operation. Optimization of overall performance.
With the upgrading of consumption and manufacturing, consumer electronics, automotive lidar, and industrial machine vision products have higher and higher performance requirements for laser 3D sensing. One of the important indicators is the efficiency and stability of VCSEL chips under high temperature operation. . This series of VCSEL products benefit from the overall optimized design, and the comparison test on the client side shows that its high temperature performance is leading the industry.
Brandnew's series of VCSEL products are suitable for large-scale mass production. They completely adopt 6-inch epitaxy and tape-out. They have extremely streamlined processing procedures and have been verified in many mature 6-inch chip foundries at home and abroad. At the same time, the product has excellent reliability and has passed the accelerated aging life test with continuous light output for more than 2000h at a heat sink temperature of 50°C.
In addition to providing standardized VCSEL laser chip products with different power options, Brandnew can also provide customized design services for chips and corresponding modules according to customer needs. For example, customers can customize conventional VCSELs with divergence angles between 20° and 30°. At the same time, Brandnew is custom-developing high energy density VCSELs for dToF applications.
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