The vertical-cavity surface-emitting laser (VCSEL) is a type of semiconductor laser diode with laser beam emission perpendicular from the top surface, contrary to conventional edge-emitting semiconductor lasers (also in-plane lasers) which emit from surfaces formed by cleaving the individual chip out of a wafer.
Vertical-cavity surface-emitting lasers (VCSELs) have various advantages over other types of lasers. These include:
01
surface emission, which offers design flexibility in addressable arrays
02
low temperature dependence of the lasing wavelength
03
superior reliability
04
a wafer-level manufacturing process
VCSEL technology and die structure
While supporting current product development in VCSEL, we continue to investigate VCSEL advanced technology to meet market requirements and better serve customers.
01
Integrated Optics
The photolithography process is used to etch in the GaAs substrate of the VCSEL flip chip. There is no VCSEL / optics assembly process needed and all is done as an integral part of the VCSEL Wafer Fab manufacturing process. This technology will significantly reduce eye-safety risks and also packaging costs (no glass diffuser or support) and chip size (primarily height). A backside emitter is needed to enable this technology while improving the heat dissipation and no wire bond is required.
02
Addressable Array Technology - Top-emitting
Addressable array is another key technology that Brandnew developed. The addressable chip will normally be used in Automotive LIDAR applications, especially 1D row scanning and 2D segment scanning. The addressable chip will also be used in dToF for consumer applications.
03
Long Wavelength VCSEL (>1000nm)
Brandnew is starting to investigate the development of long wavelength VCSEL for multiple application especially for Behind OLED.
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B-1508 Ruiding Mansion,No.200 Zhenhua Rd,Xihu District,Hangzhou,China
Phone Number
0086 181 5840 0345
info@brandnew-china.com
