The world's first 5μm single-mode 808nm 500mW laser chip Chip on Submount(COS): a new standard for high-brightness, high-precision applications.
Discover the world's first 5μm core 808nm 500mW single-mode laser chip. Ultra-compact, high-brightness, and optimized for precision fiber coupling, biomedical, and pumping systems.
Feature：
1：True single-mode output with 5μm emission aperture
2：Optical output power up to 500mW
3：Compact chip size, easy integration
Application：
1：Spectroscopy and precision optical sensing
2：Research and development in photonics
3：Scientific instrumentation
The 808nm 500mW single mode laser Chip on Submount(COS) has an emission aperture of 5μm, making it an ideal light source for high resolution spectroscopy and precision optical sensing systems.
808nm 500mW single-mode laser COS chip with 5μm emission aperture is an ideal light source for high-resolution spectroscopy and precision optical sensing systems.
With narrow beam divergence, excellent spatial coherence and stable single-mode output, it can achieve the following functions
Accurate wavelength-selective detection in near-infrared absorption spectroscopy
High signal-to-noise ratio in trace gas detection
Accurate measurement of optical properties of materials and biological samples
Interferometric measurement devices requiring phase stability and low noise
Its compact form factor and high power density make it easy to integrate into portable, miniaturized or field-deployed analytical instruments.
5μm Core 808nm 500mW Single-Mode Laser COS (Chip on Submount) package structure is where the laser chip is soldered directly onto a highly thermally conductive ceramic or metal base without a full enclosure, so that the chip's light output surface is completely exposed. This open design greatly facilitates researchers in their experiments:
1：The chip can be observed under a microscope to analyse the light-emitting area, spot characteristics and possible optical damage;
2：Directly exposed light exit surfaces for building free-space optical path systems for beam collimation, focusing or diffraction testing;
3：Convenient for precise coupling to single-mode optical fibres, waveguides or integrated photonic devices, which is an ideal package for high coupling efficiency research;
4：Facilitates the application of controlled thermal, mechanical or electrical conditions to the chip, such as the loading of heat sinks, TECs or micro-heated structures, for temperature control experiments, thermal drift measurements or package evaluation;
5：Suitable for building prototype systems of a highly customised or experimental nature, e.g. fibre laser seed sources, miniature spectroscopy systems, optical modulation structures, etc;
6：The simplicity and compactness of the package reduces the cost and cycle time of system prototyping, and can be used for multiple repetitions of packaging, testing and disassembly
Therefore, COS packages are particularly suitable for research laboratories, university teaching, photonic device development, integrated package evaluation and other scenarios. Its openness and flexibility provide great freedom for precision optical system development.
5μm Core 808nm 500mW Single-Mode Laser COS (Chip on Submount) provides researchers with an extremely flexible and open test platform, which is particularly suitable for the research and development and verification of optical coupling-related technologies. This type of packaging structure will be directly welded to the chip on a high thermal conductivity base, the chip panel exposed, easy to carry out a variety of high-precision coupling experiments, including:
Free-space beam alignment (Free-space beam alignment):
The researchers can directly align the laser emission surface through the precision displacement platform and high NA collimating lens to observe and adjust the angle, mode and divergence angle of the laser emission, in order to optimize the subsequent optical path system or beam transmission structure.
Fiber-coupling efficiency evaluation:
COS package chip provides a light exit window extremely close to the light-emitting area of the chip, which is convenient for focusing the laser accurately to the core area of the single-mode fibre, and testing the effect of different optical structures (lens combinations, mirror angles) on the coupling efficiency. It is a valuable development platform for engineers studying fibre-optic interfaces, collimator mirror design, or passive coupling systems.
Waveguide coupling and integrated photonic device matching verification (Waveguide alignment and PIC testing):
Directly interface silicon optical waveguides, InP devices, or other planar optical waveguide systems in the light-emitting region of the chip, and study the light injection efficiency and stability of different coupling structures (e.g., tapered waveguides, microlens arrays, etc.) by means of a probe stage or a chip-scale packaging platform.
Since the COS package does not have the window glass or case shielding of conventional packages, the light-emitting region can be directly aligned and observed by a high numerical aperture (NA) micro-optics system, which greatly improves the debugging accuracy and efficiency. In addition, the open structure is also more conducive to experiments in different environments (e.g., vacuum, cryogenic, and temperature-controlled platforms), which is very suitable for the validation of novel coupling devices and high-precision docking studies.
This structure is ideal for building high-performance photonic systems, validating innovative optical path designs, or evaluating novel integrated coupling technologies.