Semiconductor Laser Packaging Technology

Semiconductor laser packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. Generally, the pipe core of discrete devices is sealed in the encapsulation body. The function of encapsulation is to protect the pipe core and complete electrical interconnection. The packaging of semiconductor laser is to complete the output electrical signal, protect the normal operation of the core, output: visible light function, both electrical parameters and optical parameters of the design and technical requirements, can not simply separate device packaging for semiconductor lasers.